It was put forward that utilizing sufficiently and innovating the Calligraphy art has the far-reaching meanings for modern packaging design combined with contemporaneity art technique. 并指出结合当今的艺术表现手法,充分利用和创新书法艺术对现代包装设计具有深远的意义。
Vacuumizing is often used in the rice packaging as a fresh technique. Application of Vacuum Pump Technology by Using Liquid-ring Vacuum Pump in Large-scale CDU 真空包装是大米销售包装常用的一种保鲜技术。机械抽真空技术在大型常减压蒸馏装置的应用
Finally has carried on the study and realization to the change gear case CAD system hypothesized packaging technique. 最后对变速齿轮箱CAD系统中的虚拟装配技术进行了研究和实现。
Enhancing-sensitivity packaging technique and experimental study for fiber Bragg grating temperature sensor FBG温度传感器增敏封装技术及实验研究
Pack sth. in soft packages ( or packing) Vacuumizing is often used in the rice packaging as a fresh technique. 软包装(用软性材料包装)真空包装是大米销售包装常用的一种保鲜技术。
Packaging technique of enhancing temperature-sensitivity for fiber bragg grating sensor 光纤布拉格光栅(FBG)温度传感器增敏封装技术
Antimicrobial Packaging Technique and Its Application in Fresh Meat 抗菌包装技术及其在肉类保鲜中的应用
A new kind of thin film manganin sensor is fabricated by developing structure design, new sensing and packaging materials, and adopting new fabrication technique. 通过传感器的结构设计、敏感材料和封装材料的研制以及采用新的传感器制备工艺,制作了一种新型的薄膜式锰铜传感器。采用熔融石英材料作为绝缘基板。
Packaging Design& Computer Technique 包装设计与计算机技术
The Fabrication of SiCp/ Al Composite for Electronic Packaging by Infiltration Technique and its Mechanism 电子封装用SiCp/Al复合材料渗透法制备及渗透机制
Packaging technique of fiber Bragg grating ( FBG) is studied. Two packaging schemes of FBG, FBG strain sensor packaged by I shaped steel pole and FBG temperature sensor packaged by steel tube, are proposed and demonstrated. 研究了光纤Bragg光栅封装工艺,提出并实现了两种封装光纤Bragg光栅传感器:工字型钢管封装光纤Bragg光栅应变传感器及钢管封装光纤Bragg温度传感器。
Implementation of Long Term Storage of PCBs by a New Packaging Technique 用新型包装方法实现某电子设备印制板的长期储存
The titanium alloy slice packaging technique for fiber Bragg grating ( FBG) sensor was developed in consideration of bare optical fiber being fragility, and the strain and temperature characteristics of the packaged FBG sensors were experimentally and theoretically studied. 提出了一种光纤光栅(FBG)的Ti合金片的封装工艺,实验和理论研究了FBG的应变和温度传感特性。
The packaging technology of MEMS is a key technique for MEMS based on microelectronics packaging. MEMS封装是在微电子封装技术基础上发展起来的一项关键的MEMS技术。
The Developing Trend of Food Packaging Technique 食品包装技术的发展动向
In the open soft designing, the packaging and inheritance technique of classes was adopted, and the communication technique based on the server and client model was utilized between different function modules or between the function modules and the system kernel. 在开放式软件设计中,采用了类的封装和继承技术,不同功能模块间以及功能模块和系统内核间采用基于客户机和服务器模型的通信技术。
CONCLUSIONS Sterilized packages with ( vacuum) packaging ( technique) can extend valid period, the packages can be stored safely for at least 6 months. 结论应用真空包装技术对无菌包进行包装保存,延长了无菌包保存的有效期,保存时间可至6个月。
This paper briefly analyzes the difficulties of MEMS packaging, and elaborates the key techniques of packaging, such as wafer-bonding, wafer level packaging and flip-chip technique. grade. 简要分析了MEMS(微机电系统)器件封装的难点所在,随后介绍了晶片键合,晶片级密封,倒装芯片技术等主要的MEMS封装技术。
As a packaging technique, COB ( Chip on Board) structure is usually used in IC and MEMS. However, the thermomechanical coupling effect because of CTE mismatch of different materials in COB will greatly affect the reliability and performance of the devices. COB(chiponBoard)是微电子和MEMS中常用的封装工艺之一,但该封装结构中由于多层异质材料耦合引入的热失配将对器件的性能和可靠性产生重要影响。
Web Page Packaging Technique Based on Java Server Page 基于JSP的Web页面组装技术
Active packaging has developed as a technique to keep the quality and safety of food by itself. 活性包装可以降低外部因素对包装内部食品的影响,保持食品的品质和安全。
Modified atmosphere packaging ( MAP) is one important technique that can be used to extend shelf life of fresh fruits and vegetables. 气调包装是一种可延长新鲜水果货架寿命的重要技术。
Finally, a LC band pass filters designed with LTCC is provided. Low Temperature Co-fired Ceramics ( LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multi-chip modules ( MMCM). 给出了采用内埋置LTCC技术设计LC滤波器的例子,低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)一种理想的组装技术。
Realization of the Programme Control Dividing Packaging Technique in Belt Conveying Line 胶带输送线程控分包技术的实现
The Permeability is a main governing index of plastic for packaging, and cascade compound is a main governing technique. 渗透性是包装用塑料的主要控制指标,积层复合则是主要的控制技术。
Packaging design, comprised of both elements of the technique and art, plays a very important role in increasing the circulation of commodities, and embellishing our everyday life. 包装设计融汇了技术设计与艺术设计的双重因素,对促进现代商业流通与美化日常生活起着不可忽视的作用。
DLL Packaging Technique in MIS Foreground Application Development MIS前台应用开发中的DLL封装技术
With the steady development and perfection of Modified atmosphere packaging ( MAP) technique, excellent functions and features of fresh-keeping were reflected clearly. 随着气调保鲜包装技术的不断发展和完善,优越的保鲜功能和特点越来越明显地体现出来。
The multi-chip module technology of the three-dimension ( 3D-MCM) is the important direction of the modern microelectronics packaging technology development and a cross-century key technology of microelectronic technique field. 三维多芯片组件技术(3D-MCM)是现代微组装技术发展的重要方向,是微电子技术领域跨世纪的一项关键技术。
According to these requirements, it is necessary to introduce the low-dielectric-constant ( k) dielectrics and Cu for interconnection, and on the other side, packaging technique and reliability are also facing great challenges. 为了满足这些要求,一方面需要在互连技术中引入低介电常数介质与铜金属互连线;另一方面,电子封装技术也面临着可靠性的巨大挑战。